中文簡(jiǎn)介

《IEEE電磁兼容性匯刊》發(fā)表了與電磁兼容性（EMC）所有學(xué)科和相關(guān)方法相關(guān)的原始和重要貢獻(xiàn)，以預(yù)測(cè)、評(píng)估和預(yù)防電磁干擾（EMI）并提高設(shè)備/產(chǎn)品的抗擾度。本出版物的范圍包括但不限于電磁環(huán)境；干擾控制；電磁兼容性和電磁干擾建模；大功率電磁學(xué)；電磁兼容性標(biāo)準(zhǔn)、電磁兼容性測(cè)量方法；計(jì)算電磁學(xué)和信號(hào)及功率完整性，如適用或與電磁兼容性問題直接相關(guān)；傳輸通信線路；靜電放電和雷電效應(yīng)；無線和光學(xué)技術(shù)中的電磁兼容性；印刷電路板和系統(tǒng)設(shè)計(jì)中的電磁兼容性。

　　英文簡(jiǎn)介

IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.

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