中文簡(jiǎn)介

電子包裝雜志發(fā)表論文，使用實(shí)驗(yàn)和理論(分析和計(jì)算機(jī)輔助)的方法、方法和技術(shù)來解決和解決在電子和光子學(xué)組件、設(shè)備和系統(tǒng)的分析、設(shè)計(jì)、制造、測(cè)試和操作中遇到的各種機(jī)械、材料和可靠性問題。

　　英文簡(jiǎn)介

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

　　近年期刊自引率趨勢(shì)圖

　　JCR分區(qū)

JCR分區(qū)等級(jí)	JCR所屬學(xué)科	分區(qū)	影響因子
Q3	ENGINEERING, ELECTRICAL & ELECTRONIC	Q3	1.931
	ENGINEERING, MECHANICAL	Q3

　　近年期刊影響因子趨勢(shì)圖

　　CiteScore數(shù)值

CiteScore	SJR	SNIP	學(xué)科類別	分區(qū)	排名	百分位
3.70	0.493	0.861	大類：Engineering 小類：Mechanics of Materials	Q2	145 / 384	62%
			大類：Engineering 小類：Electrical and Electronic Engineering	Q2	284 / 708	59%
			大類：Engineering 小類：Computer Science Applications	Q2	307 / 747	58%
			大類：Engineering 小類：Electronic, Optical and Magnetic Materials	Q2	122 / 259	53%

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