中文簡介

焊接和表面貼裝技術致力于在這一重要領域的知識和專業技術體系內對研究和應用的進展作出重要貢獻。焊錫和表面貼裝技術是其姊妹出版物，電路世界和微電子國際。該雜志包括一個多學科研究的關鍵材料和技術用于組裝最先進的功能性電子設備。重點是通過焊接組裝設備和互連組件，同時還包括廣泛的相關方法。涵蓋的主題范圍包括：焊接科學與技術新的焊接工藝和新的焊接合金表面貼裝技術表面安裝組件先進的封裝技術和3D互連倒裝芯片/BGA/SIP/TSV新型基板和嵌入式組件可焊表面和涂層絲網印刷導電粘合劑和保形涂層可靠性質量控制檢驗和測試返工和修理環境因素

　　英文簡介

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are:Soldering science and technologyNovel soldering processes and new solder alloysSurface mount technology (SMT)Surface mount assemblyAdvanced packaging technologies and 3D interconnectsFlip chip/BGA/SiP/TSVNovel substrates and embedded componentsSolderable finishes and coatingsScreen printingConductive adhesives and conformal coatingsReliabilityQuality controlInspection and testingRework and repairEnvironmental aspects

　　近年期刊自引率趨勢圖

　　JCR分區

JCR分區等級	JCR所屬學科	分區	影響因子
Q3	METALLURGY & METALLURGICAL ENGINEERING	Q3	1.494
	MATERIALS SCIENCE, MULTIDISCIPLINARY	Q4
	ENGINEERING, ELECTRICAL & ELECTRONIC	Q4
	ENGINEERING, MANUFACTURING	Q4

　　近年期刊影響因子趨勢圖

　　CiteScore數值

CiteScore	SJR	SNIP	學科類別	分區	排名	百分位
3.60	0.256	0.801	大類：Engineering 小類：Electrical and Electronic Engineering	Q2	287 / 708	59%
			大類：Engineering 小類：Condensed Matter Physics	Q2	184 / 415	55%
			大類：Engineering 小類：General Materials Science	Q2	225 / 455	50%

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